Appendix C
Si and SiO2 Etch Rates in KOH
|
TABLE 1<100> Silicon Etch Rates in [mm/hr] for
Various KOH Concentrations and Etch Temperatures as Calculated from Eq. [A-1]
by Setting E0 = 0.595 eV and k0 = 2480 mm/hr ·
(mol/L)–4.25 |
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|
|
Temperature
[˚C] |
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|
% KOH |
20˚ |
30˚ |
40˚ |
50˚ |
60˚ |
70˚ |
80˚ |
90˚ |
100˚ |
|
|
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|
10 |
1.49 |
3.2 |
6.7 |
13.3 |
25.2 |
46 |
82 |
140 |
233 |
|
15 |
1.56 |
3.4 |
7.0 |
14.0 |
26.5 |
49 |
86 |
147 |
245 |
|
20 |
1.57 |
3.4 |
7.1 |
14.0 |
26.7 |
49 |
86 |
148 |
246 |
|
25 |
1.53 |
3.3 |
6.9 |
13.6 |
25.9 |
47 |
84 |
144 |
239 |
|
30 |
1.44 |
3.1 |
6.5 |
12.8 |
24.4 |
45 |
79 |
135 |
225 |
|
35 |
1.32 |
2.9 |
5.9 |
11.8 |
22.3 |
41 |
72 |
124 |
206 |
|
40 |
1.17 |
2.5 |
5.3 |
10.5 |
19.9 |
36 |
64 |
110 |
184 |
|
45 |
1.01 |
2.2 |
4.6 |
9.0 |
17.1 |
31 |
55 |
95 |
158 |
|
50 |
0.84 |
1.8 |
3.8 |
7.5 |
14.2 |
26 |
46 |
79 |
131 |
|
55 |
0.66 |
1.4 |
3.0 |
5.9 |
11.2 |
21 |
36 |
62 |
104 |
|
60 |
0.50 |
1.1 |
2.2 |
4.4 |
8.4 |
15 |
27 |
47 |
78 |
|
|
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TABLE 2<100> Silicon Etch Rates in [mm/hr] for
Various KOH Concentrations and Etch Temperatures as Calculated from Eq. [A-1]
by Setting E0 = 0.60 eV and k0 = 4500 mm/hr ·
(mol/L)–4.25 |
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|
|
Temperature
[˚C] |
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|
% KOH |
20 ˚ |
30˚ |
40˚ |
50˚ |
60˚ |
70˚ |
80˚ |
90˚ |
100˚ |
|
|
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|
10 |
2.2 |
4.8 |
10.1 |
20.1 |
38 |
71 |
126 |
216 |
362 |
|
15 |
2.3 |
5.1 |
10.6 |
21.2 |
40 |
74 |
132 |
228 |
381 |
|
20 |
2.3 |
5.1 |
10.7 |
21.3 |
41 |
75 |
133 |
229 |
383 |
|
25 |
2.3 |
5.0 |
10.4 |
20.6 |
39 |
73 |
129 |
222 |
372 |
|
30 |
2.1 |
4.7 |
9.8 |
19.4 |
37 |
68 |
121 |
209 |
350 |
|
35 |
2.0 |
4.3 |
8.9 |
17.8 |
34 |
63 |
111 |
192 |
321 |
|
40 |
1.7 |
3.8 |
8.0 |
15.9 |
30 |
56 |
99 |
171 |
285 |
|
45 |
1.5 |
3.3 |
6.9 |
13.7 |
26 |
48 |
85 |
147 |
246 |
|
50 |
1.2 |
2.7 |
5.7 |
11.3 |
22 |
40 |
71 |
122 |
204 |
|
55 |
1.0 |
2.2 |
4.5 |
9.0 |
17 |
31 |
56 |
96 |
161 |
|
60 |
0.7 |
1.6 |
3.4 |
6.7 |
13 |
24 |
42 |
72 |
121 |
|
|
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|
TABLE 3Calculated Etch Rates of Thermally Grown Silicon
Dioxide in [nm/hr] for Various KOH Concentrations and Etch Temperatures.
Calculation was Based on Best Numerical Fit of Experimental Data. The
Activation Energy was Taken to be 0.85 eV |
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|
|
Temperature
[˚C] |
||||||||
|
% KOH |
20˚ |
30˚ |
40˚ |
50˚ |
60˚ |
70˚ |
80˚ |
90˚ |
100˚ |
|
|
|||||||||
|
10 |
0.40 |
1.22 |
3.5 |
9.2 |
23 |
54 |
123 |
266 |
551 |
|
15 |
0.63 |
1.91 |
5.4 |
14.4 |
36 |
85 |
193 |
416 |
862 |
|
20 |
0.88 |
2.66 |
7.5 |
20.0 |
50 |
118 |
268 |
578 |
1200 |
|
25 |
1.14 |
3.46 |
9.8 |
26.0 |
65 |
154 |
348 |
752 |
1560 |
|
30 |
1.42 |
4.32 |
12.2 |
32.5 |
81 |
193 |
435 |
940 |
1950 |
|
35 |
1.44 |
4.37 |
12.4 |
32.8 |
82 |
195 |
440 |
949 |
1970 |
|
40 |
1.33 |
4.03 |
11.4 |
30.3 |
76 |
180 |
406 |
876 |
1820 |
|
45 |
1.21 |
3.67 |
10.4 |
27.5 |
69 |
163 |
369 |
797 |
1650 |
|
50 |
1.08 |
3.28 |
9.3 |
24.6 |
62 |
146 |
330 |
713 |
1480 |
|
55 |
0.95 |
2.87 |
8.1 |
21.6 |
54 |
128 |
289 |
624 |
1290 |
|
60 |
0.81 |
2.45 |
6.9 |
18.4 |
46 |
109 |
246 |
532 |
1100 |
|
|
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|
Source: After Seidel et al., J.
Electrochem. Soc.,
137, 3612–26, 1990. With permission. |
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