Chapter 3: Pattern Transfer with Additive Techniques
Introduction
Silicon Growth
Doping of Si
Introduction
Conductivity of Semiconductors
Si Doping by Diffusion
Doping by Implantation
Oxidation of Silicon
Kinetics
Orientation Dependence of Oxidation Kinetics
Thermal SiO2 Properties
Physical Vapor Deposition
Introduction
Thermal Evaporation
Sputtering
Molecular Beam Epitaxy
Laser Sputter Deposition or Ablation Deposition
Ion Plating
Cluster Beam Technology
Chemical Vapor Deposition
Introduction
Reaction Mechanisms
Step Coverage
Energy Sources for CVD Processes
Overview of CVD Process Types
Plasma-Enhanced CVD
Atmospheric Pressure CVD
Low Pressure CVD
Very Low Pressure CVD
ECR CVD and Example of a High Density Plasma (HDP)
Metallorganic CVD
Spray Pyrolysis
Epitaxy
Introduction
Liquid and Solid Phase Epitaxy
Selective Epitaxy
Epilayer Thickness
CVD Equipment
Silk-Screening or Screen-Printing
Introduction
How It Works
Types of Inks
Traditional Inks
Inks for Chemical Sensors
Sol-Gel Deposition Technique
Doctors’ Blade or Tape Casting
Plasma Spraying
Introduction
How It works
Deposition and Arraying Methods of Organic Layers in BIOMEMS
Introduction
Deposition Methods
Spin Coating
Dip Coating
Plastic Spraying
Casting
Doctor’s Blade or Tape Casting
Glow Discharge (Plasma) Polymerization
Langmuir-Blodgett and SAM Approach
Patterning of Organic Materials
Introduction
Patterning Through Photolithography
Patterning of Hydrogels, Gas Permeable Membranes and Ion Selective Electrodes
Very Large Scale Immobilized Polymer Patterning and Synthesis
Proteins Patterning with Lithography
Digital Mirror Array Patterning
Inkjetting and Microspotting
Introduction
Ink-jet Printing
Mechanical Microspotting
Micro-Contact Printing
Conductive Polymer Patterning
Thin versus Thick Film Deposition
Selection Criteria for Deposition Method
Examples
3.1 Spray Pyrolysis
3. 2 Plasma-Beam Deposition
3.3 Proposed Scenario for Continuous Manufacture of Polymer/Metal Based Biosensors
Problems