Chapter 8: Modeling, Brains, Packaging, Sample Preparation and New MEMS Materials

Introduction

Modeling

Introduction

Finite Element Analysis

Introduction

Geometry Development

Material Property Assignment

Mesh Generation

Boundary and Loading Conditions

Run Analysis

Results

Data Correlation and Design Optimization

CAD for MEMS

Introduction

IC Derived CAD Packages for MEMS

CAD Specifically Developed for MEMS

Future of CAD for MEMS

Brains in MEMS

Introduction

State of the Art in Computer Development

Brains in Nature

Artificial Intelligence

Two Contenders: Top-Down and Bottom-Up

Traditional AI

Natural AI

Complexity Theory

Artificial Life

Artificial Neural Network Software

Packaging

Introduction

Packaging in ICs versus in Mechanical Micromachines

ICs

Packaging in MEMS

Dicing

Cavity Sealing and Bonding

Cavity Sealing

Introduction

Sealing of Polysilicon and Silicon Nitride Cavities

Epitaxial Cavity Sealing

HEXSIL Cavity Sealing

Bonding

Field-Assisted Thermal Bonding

Field-Assisted Thermal Bonding Modifications

Silicon Fusion Bonding

Thermal Bonding with Intermediate Layers

Eutectic Bonding

Bonding with Organic Photopatternable Layers

Bonding of Plastic to Plastic

Alignment during Bonding

Imaging and Bond Strength and Package Hermeticity Tests

Higher Levels of Packaging—L2 to L5

Introduction

Sensor Die Attach and Wire Bond in a TO-8 Header

Die Protection

Nonstandard Packages

Stress Isolation and Thermal Management

Connections between Layers—Multichip Packages and Flip-Chip Bonding

Wet Etching

Dry Etching

Laser Drilling

Temperature Zone Melting (TZM)

Interconnects between Plastic Layers

Partitioning

Introduction

Monolithic versus Hybrid MEMS

Partitioning in a Microfluidic Instrument

Introduction

Fluid Propulsion Methods and MEMS Integration

Mechanical Pumps

Acoustic Streaming

Electrophoresis/Electro-Osmosis

Centrifugal Pumping

Vacuum Pressure Reservoir

Heating and Cooling and MEMS Integration

Sample Introduction

Manufacturing Technique of Disposable

Micro and Nano Assembly

Introduction

Scaling of the Assembly Process

Micro-assembly Examples

Serial Micro Assembly

Parallel Micro Assembly

DNA-Mediated Assembly

Biocompatibility

Definition

History

Mechanism

Biocompatibility and MEMS

Mechanical and Chemical Components of Biocompatibility

Biocompatibility of Si in MEMS

Surface Modifications

Sample Preparation in Molecular Diagnostics

Introduction

Types of Samples

Sample Preparation Protocols for Integrated DNA Analysis Devices

General Principles

Sample Size

Lysing

Mechanical Methods

Nonmechanical Methods

Examples of Integrated Sample Preparation

Substrate Choice

Introduction

Quartz MEMS

Micromachining and Surface Microstructuring of Ceramics

Polyimide MEMS

Examples

8.1 Packaging of a Variable Entrance Slit for a Spectrophotometer

8.2 A Miniature Surface Plasmon Resonance (SPR) Sensor – Spreeta^TM

Problems